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https://designers-guide.org/forum/YaBB.pl Design >> High-Speed I/O Design >> 0.18um TSMC CUP Pads https://designers-guide.org/forum/YaBB.pl?num=1278249869 Message started by Mohamed on Jul 4th, 2010, 6:24am |
Title: 0.18um TSMC CUP Pads Post by Mohamed on Jul 4th, 2010, 6:24am Kindly I want to know the difference between the following 0.18um TSMC CUP Pads: (1) PAD50LAU (2) PAD60LU (3) PAD70LU (4) PAD80LU |
Title: Re: 0.18um TSMC CUP Pads Post by bernd on Jul 5th, 2010, 1:07am The number indicates the bondpad opening in microns. * |
Title: Re: 0.18um TSMC CUP Pads Post by raja.cedt on Jul 5th, 2010, 3:56am hi, i guess those numbers are pad pich's. Thanks, Rajasekhar. |
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