The Designer's Guide Community Forum

The Designer's Guide Community Forum
https://designers-guide.org/forum/YaBB.pl
Design >> High-Speed I/O Design >> 0.18um TSMC CUP Pads
https://designers-guide.org/forum/YaBB.pl?num=1278249869

Message started by Mohamed on Jul 4^th, 2010, 6:24am

Title: 0.18um TSMC CUP Pads
Post by Mohamed on Jul 4^th, 2010, 6:24am

Kindly I want to know the difference between the following 0.18um TSMC CUP Pads:

(1) PAD50LAU
(2) PAD60LU
(3) PAD70LU
(4) PAD80LU

Title: Re: 0.18um TSMC CUP Pads
Post by bernd on Jul 5^th, 2010, 1:07am

The number indicates the bondpad opening in microns.

*

Title: Re: 0.18um TSMC CUP Pads
Post by raja.cedt on Jul 5^th, 2010, 3:56am

hi,
i guess those numbers are pad pich's.
Thanks,
Rajasekhar.