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Design >> Mixed-Technology Design >> Die per Wafer !
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Message started by modu on Feb 24th, 2012, 3:29am

Title: Die per Wafer !
Post by modu on Feb 24th, 2012, 3:29am

Hello Everyone ! I'm currently reading a book about computer Architecture and i know that the number of die per wafer can be calculated as : dies per wafer = [PI*(waferdiameter/2)^2]/die area (PI*waferdiameter)/sqrt(2*die area) .

I was reading this example : Find the number of dies per 300mm (30 cm) wafer for a die that is 1.5 cm on a side .

The answer say : The die is 2.25 cm^2 .Thus
Die per wafer = PI * (30/2)2 / 2.25   - (PI * 30) / Sqrt( 2* 2.25) = 270.

my problem is where did the 2.25 come from ? Please help ?

Title: Re: Die per Wafer !
Post by boe on Feb 24th, 2012, 5:46am

Modu,
A hint: How do you calculate the area of a rectangle?

- B O E

Title: Re: Die per Wafer !
Post by modu on Feb 24th, 2012, 9:11am

Area of rectangle is : Width x Height .

so, which means the 1.5 cm is only one side/ half  of the area ?

Title: Re: Die per Wafer !
Post by loose-electron on Feb 24th, 2012, 2:17pm

please, is this a joke?

1.5cm is the length of one side
the die is square
1.5 X 1.5 = 2.25cm^2 which is the area.


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