The Designer's Guide Community Forum https://designers-guide.org/forum/YaBB.pl Design >> Mixed-Technology Design >> Die per Wafer ! https://designers-guide.org/forum/YaBB.pl?num=1330082979 Message started by modu on Feb 24th, 2012, 3:29am

 Title: Die per Wafer ! Post by modu on Feb 24th, 2012, 3:29am Hello Everyone ! I'm currently reading a book about computer Architecture and i know that the number of die per wafer can be calculated as : dies per wafer = [PI*(waferdiameter/2)^2]/die area – (PI*waferdiameter)/sqrt(2*die area) . I was reading this example : Find the number of dies per 300mm (30 cm) wafer for a die that is 1.5 cm on a side . The answer say : The die is 2.25 cm^2 .ThusDie per wafer = PI * (30/2)2 / 2.25   - (PI * 30) / Sqrt( 2* 2.25) = 270.my problem is where did the 2.25 come from ? Please help ?

 Title: Re: Die per Wafer ! Post by boe on Feb 24th, 2012, 5:46am Modu,A hint: How do you calculate the area of a rectangle?- B O E

 Title: Re: Die per Wafer ! Post by modu on Feb 24th, 2012, 9:11am Area of rectangle is : Width x Height .so, which means the 1.5 cm is only one side/ half  of the area ?

 Title: Re: Die per Wafer ! Post by loose-electron on Feb 24th, 2012, 2:17pm please, is this a joke?1.5cm is the length of one sidethe die is square1.5 X 1.5 = 2.25cm^2 which is the area.