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Modeling >> Passive Devices >> How to reduce substrate coupling to the high frequency clock routing
https://designers-guide.org/forum/YaBB.pl?num=1678927667

Message started by polyam on Mar 15^th, 2023, 5:47pm

Title: How to reduce substrate coupling to the high frequency clock routing
Post by polyam on Mar 15^th, 2023, 5:47pm

Hi,

I am using one of the top metals (for the sake of discussion let's call it m5) in the given technology to ship a high frequency complementary (differential) clock from one point to the destination (by high frequency I meant +50GHz). Let's say I have 100-200um differential traces (m5) and side-shielded by the same metal (m5). Do you think putting lower metals (let's say m2) as a ground plane underneath of the clock path and connect it to a substrate via a substrate contact would reduce the substrate coupling? how does it reduce the coupling? how to model that ? which tools can model the substrate coupling/noise ?

Thanks