didac
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There's a million ways to see the things in life
Posts: 247
manresa,spain
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Hi again, I was thinking that I don't really answer your question. If you think how the IC is fabricated you will see that the foundry maka one layer at time(first ion implantation, then heat to growth...), referring to metals first you have metaln after the etch the oxide growth and you have metaln+1. So if you have a track made in metaln and you break it to prevent antenna, during etching it will atract ions but when the ions arrive at the break they won't find a path to continue because your bridge in metaln+1 will not be fabricated yet. Hope it helps,
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