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Proper gounding for wafer probing. (Read 3582 times)
HFG
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Proper gounding for wafer probing.
Nov 22nd, 2007, 2:55pm
 
I have access to a GGB wafer wedge that holds 2 GSG probes and 4 DC probes. Iam trying to maximize the number of connections i can use and was wondering if i can use the grounds from the RF probes for my circuit ground or if i have to use one of the 4 DC probes.
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Stefan
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Re: Proper gounding for wafer probing.
Reply #1 - Nov 23rd, 2007, 1:07am
 
You can use the G from GSG for ground -
IF
- you don't care about ESD structures (remember that normally you should contact ground & VDD for ESD first, before connecting signals ...)
- your probe is able to carry enough dc current that might be used by the chip.
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HFG
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Re: Proper gounding for wafer probing.
Reply #2 - Nov 23rd, 2007, 1:08pm
 
Thanks for the reply, thats pretty much what i figured. I can't seem to find one source that contains all the information about probing. I can't find little bit of information here and there.
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