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Design >> Mixed-Signal Design >> choosing IC packages and sockets
https://designers-guide.org/forum/YaBB.pl?num=1150206749

Message started by vivkr on Jun 13^th, 2006, 6:52am

Title: choosing IC packages and sockets
Post by vivkr on Jun 13^th, 2006, 6:52am

Hi,

I would like to know if there are any good references on choosing IC packages for use in high-performance designs? I have some appnoteson PCB design which discuss the matter very briefly but no reference which offers a good comparison between the various leadless packages available these days.

My interest is primarily in choosing a package for lab evaluations, and so ceramic packages are ok. The other point concerns IC sockets. Ideally, one would directly mount a very good package on the PCB. However, this makes life hard if one is trying to do lab evaluations and needs to do tests on various parts. Most of the IC sockets that I have come across are bad enough that the benefits of using the best of packages are lost.

How should one approach these two issues in order to get the best performance out of a chip?

Thanks
Vivek

Title: Re: choosing IC packages and sockets
Post by huber on Jun 13^th, 2006, 12:53pm

Hi Vivek,
I am under the impression that BGAs provide the lowest inductance package for reasonably high pin count, but like you I don't really have a reference that confirms this assumption. I know you can get reasonably good BGA sockets but be prepared to shell out around $500 for one. I've also seen flip-chip sockets that don't even require a package but I have no idea of their price/performance.
Good luck!
-Dan