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https://designers-guide.org/forum/YaBB.pl Modeling >> Semiconductor Devices >> cryogenic operation of semiconductor devices https://designers-guide.org/forum/YaBB.pl?num=1150896966 Message started by vivkr on Jun 21st, 2006, 6:36am |
Title: cryogenic operation of semiconductor devices Post by vivkr on Jun 21st, 2006, 6:36am Hi, I am just curious as to how Si chips are able to work down to very low temperatures (5K as used in IBM's experimental 500 GHz processor). Is there no "freezeout temperature" below which the available thermal energy is insufficient to free enough carriers from the donor and acceptor levels? Thanks Vivek |
Title: Re: cryogenic operation of semiconductor devices Post by Marc on Jun 21st, 2006, 10:57am That's a good question. I guess I could check the textbooks, but I seem to recall that it wouldn't take too much energy to put donor electrons into the conduction band. Although, the number of intrinsic carrier pairs from thermal generation would be quite low. |
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