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Design >> Analog Design >> pad model
https://designers-guide.org/forum/YaBB.pl?num=1158011253

Message started by grosser on Sep 11^th, 2006, 2:47pm

Title: pad model
Post by grosser on Sep 11^th, 2006, 2:47pm

hello

Do i connect R in series with L or parallelly in simple pad model??

regards

Title: Re: pad model
Post by uncle_ezra on Sep 11^th, 2006, 6:00pm

You should have a resistor in series with an inductor to model the bondwire and a resistor in series to a capacitor to model the pad.

Title: Re: pad model
Post by grosser on Sep 12^th, 2006, 12:21am

uncle_ezra wrote on Sep 11^th, 2006, 6:00pm:

You should have a resistor in series with an inductor to model the bondwire and a resistor in series to a capacitor to model the pad.

thanks

How much R and C should i choose for pad model?

Title: Re: pad model
Post by ACWWong on Sep 12^th, 2006, 2:57am

C depends on the pad area and distance to substrate (ie which metal layer is at the bottom of the pad metal stack)
R depends on your process and layout. The process parameters needed are things like substate resistivity etc. Layout effects like where you put sub contacts will also matter. You can uses tools like ASITIC or other extraction tools to help you evaluate it.