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https://designers-guide.org/forum/YaBB.pl Design >> Analog Design >> pad model https://designers-guide.org/forum/YaBB.pl?num=1158011253 Message started by grosser on Sep 11th, 2006, 2:47pm |
Title: pad model Post by grosser on Sep 11th, 2006, 2:47pm hello Do i connect R in series with L or parallelly in simple pad model?? regards |
Title: Re: pad model Post by uncle_ezra on Sep 11th, 2006, 6:00pm You should have a resistor in series with an inductor to model the bondwire and a resistor in series to a capacitor to model the pad. |
Title: Re: pad model Post by grosser on Sep 12th, 2006, 12:21am uncle_ezra wrote on Sep 11th, 2006, 6:00pm:
thanks How much R and C should i choose for pad model? |
Title: Re: pad model Post by ACWWong on Sep 12th, 2006, 2:57am C depends on the pad area and distance to substrate (ie which metal layer is at the bottom of the pad metal stack) R depends on your process and layout. The process parameters needed are things like substate resistivity etc. Layout effects like where you put sub contacts will also matter. You can uses tools like ASITIC or other extraction tools to help you evaluate it. |
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