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https://designers-guide.org/forum/YaBB.pl Design >> RF Design >> Does the PA-Driver need on-chip bypass caps https://designers-guide.org/forum/YaBB.pl?num=1165560008 Message started by michael_li on Dec 7th, 2006, 10:40pm |
Title: Does the PA-Driver need on-chip bypass caps Post by michael_li on Dec 7th, 2006, 10:40pm The 2000M PA-Drvier is a common-emitter SiGe BJT amplifier with on-chip about 7nH RFC inductor, gnd pad bonding to exposed pad, and the output power is 8dBm while meeting the ACLP requriments , so dose the PA-Driver need on-chip supply bypass caps to minimize the supply bondwire effect, or for other reasons, in your experence ? Please give me some suggestions!! |
Title: Re: Does the PA-Driver need on-chip bypass caps Post by William Ngai on Dec 8th, 2006, 1:29pm It depends on whether your bondwire is part of you matching circuit for presenting optimum load to the collector. The ultimate target is to present a load (with all parasitics) that allow you to extract the power at reasonable efficiency while meeting your ACLP requirement. Will |
Title: Re: Does the PA-Driver need on-chip bypass caps Post by michael_li on Dec 8th, 2006, 9:58pm Thank you William. ::) |
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