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Design >> RF Design >> bondwire inductance matching
https://designers-guide.org/forum/YaBB.pl?num=1187873914

Message started by aaron_do on Aug 23^rd, 2007, 5:58am

Title: bondwire inductance matching
Post by aaron_do on Aug 23^rd, 2007, 5:58am

Hi all,

how well matched are bond wire inductances? For example, if i have a differential LNA and each half needs a separate bondwire inductance, how good is the matching? Also, how accurate is the absolute value of the bondwire?

thanks,
Aaron

Title: Re: bondwire inductance matching
Post by ACWWong on Aug 23^rd, 2007, 9:57am

bonder repeatability is excellent, landing points are typically +/-10um, and looping is very well controlled.

matching other than this will depend on your bonding diagram and pin-out/leadframe. For well matched bondwires of course you must pay attention to these (critical high frequency differential pads on the middle of the die/package sides are best because they are short and less exposed to ESD events).

Modelling can be complicated by adjacent (adjacent +1, +2 etc. as well depending on land pitch), so a good em simulation of bondwires and package is needed.