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Design >> Analog Design >> Bonding wires model power ic
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Message started by michele bergo on Jul 18^th, 2008, 3:20am

Title: Bonding wires model power ic
Post by michele bergo on Jul 18^th, 2008, 3:20am

Hi guys!!!
anybody know how to model with a good approximation (without using 3D simulators) the selfinductance and the mutual inductance of n parallel bonding wires?

Title: Re: Bonding wires model power ic
Post by sheldon on Jul 20^th, 2008, 7:04pm

Michele,

You might want to try this paper, it has a little different focus
but does provide some equations,

"Advances in RF Packaging Technologies for Next-GenerationWireless
Communications Applications (Invited Paper)", Larry Larsen and
Darryl Jessie, CICC, 2003

It give the formula for bond wire inductance and comments on the
effect of multiple bond wires.

Best Regards,

Sheldon

Title: Re: Bonding wires model power ic
Post by michele bergo on Jul 21^st, 2008, 5:14am

Hi Sheldon!
I will try it as soon as possible and I will give you a feedback.
Thank you very much.

best regards

michele

sheldon wrote on Jul 20^th, 2008, 7:04pm: