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Message started by chungming on Nov 22nd, 2008, 6:24am

Title: mos corner question
Post by chungming on Nov 22nd, 2008, 6:24am

we often say mos has tt ss ff sf fs corners.
the s corner due to think tox and f corner refer to thin tox process,
then vth will be larger or smaller.
The oxide of pmos and nmos are processed in the same time.
So the sf and fs corner is possible??
thanks ~ !!

Title: Re: mos corner question
Post by Tareeq on Nov 22nd, 2008, 6:57am

Hi,

In fact, we should consider the gradient doping over the wafer.

First of all Vt is not only dependant on the gate oxide thickness according to the equation stated below since the substrate doping Na is  also involved. (Since if you want to switch from accumulation region to inversion you need enough substrate-doping dependant charges  underneath the gate to compensate for the positive charge above the gate)

Second, the doping also affect in various way the drift and (to a lower extent in MOS technology) diffusion currents, therefore: the transconductance - that render the speed at fixed parasitic capacitance - is varying.

Regards,

Tareeq

Title: Re: mos corner question
Post by vivkr on Nov 24th, 2008, 12:08am


chungming wrote on Nov 22nd, 2008, 6:24am:
we often say mos has tt ss ff sf fs corners.
the s corner due to think tox and f corner refer to thin tox process,
then vth will be larger or smaller.
The oxide of pmos and nmos are processed in the same time.
So the sf and fs corner is possible??
thanks ~ !!


Possible - YES
Probable - Not very likely.

The sf and fs corners are very rare in production for most processes.

Regards,

Vivek

Title: Re: mos corner question
Post by Tlaloc on Nov 24th, 2008, 8:58am


Quote:
The sf and fs corners are very rare in production for most processes.

I think this can be very misleading.  It would be physically impossible to have two different thicknesses of Tox for the PMOS and NMOS.  Because of that, the fs and sf corners are always pessimistic.  However, since the N's and P's have two different Vt adjust implant steps, the corners will be at least somewhat uncorrelated.  There still is some level of correlation since the Vt does depend on the thickness of the oxide during the implant step, however, for modeling purposes, they are always assumed to be fully uncorrelated, i.e. correlation coefficient of 0.

Assuming that the Vt's are uncorrelated, then the sf and fs corners are just as likely as the ss and ff corners in terms of Vt.  As mentioned above, though, the models present a capacitive loading situation that is not physically possible.  

At the heart of all of this is what parameter is most important to your particular circuit.  Some combinations for some parameters are unrealizable, but that does not discount those corners since an s or f corner does not mean one thing.

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