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https://designers-guide.org/forum/YaBB.pl Design >> RF Design >> QFN48: maximum die size https://designers-guide.org/forum/YaBB.pl?num=1257764805 Message started by Faisal on Nov 9th, 2009, 3:06am |
Title: QFN48: maximum die size Post by Faisal on Nov 9th, 2009, 3:06am Dear Packaging Gurus :) I have a question related to QFN48: What is the maximum die size that can be placed inside this package? There are also down bonds to the paddle and I am not not sure how much margin should be allocated for them. have fun, Faisal |
Title: Re: QFN48: maximum die size Post by loose-electron on Nov 9th, 2009, 5:09pm Put the inquiry to the packaging manufacturer. As well, ask the assembly shop what space they need to hit the ground slug with the downbonds. |
Title: Re: QFN48: maximum die size Post by pauloau on Nov 11th, 2009, 12:06pm Hi, From the site of a manufacturer (ASE) I could find the value for the die size to be 3.8 x 3.8. http://www.asetwn.com.tw/content/2-4-4-1.html Regards, Paulo |
Title: Re: QFN48: maximum die size Post by loose-electron on Nov 11th, 2009, 2:14pm yes but frequently each package manufacturer is slightly different inside, and certain shops want different space allocations for the downbond area. Bottom line: Talk to both you package manufacturing shop, and your assembly people (die mount and bonding) and make sure everyone agrees before the layout and tape-out. |
Title: Re: QFN48: maximum die size Post by ACWWong on Nov 11th, 2009, 3:25pm As loose has said, QFN48 encompasses alot of packages, each with slightly different dimensions, construction, diepad/paddle size etc.... and then there are different bonding houses with again different rules for downbonds clearance, max die size, max bond angles etc. but having said that, a safe rule of thumb is 0.5mm for a down bond is something most bonding houses would easily be able to make. |
Title: Re: QFN48: maximum die size Post by loose-electron on Nov 12th, 2009, 5:51pm Rule one of successful design: Assume Nothing. A trip to the foundry costs between $100k and $2.5E6 If you have to re-layout the chip and take it to the foundry again, you just spent somebody's lunch money for the rest of their life. Please see rule 1. Check with both your package supplier and the group doing the assembly & bonding. Get the die size definition and bonding placements approved and checked before the chip goes together. Jerry |
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