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Design >> Analog Design >> Concern of connecting thin-oxide device to ground/power
https://designers-guide.org/forum/YaBB.pl?num=1279212688

Message started by neoflash on Jul 15^th, 2010, 9:51am

Title: Concern of connecting thin-oxide device to ground/power
Post by neoflash on Jul 15^th, 2010, 9:51am

In sub-130nm process, tsmc requested to use tie-high tie-low for soft connection to power/gnd bus.

Not sure what kind of issue is getting worried? CDM, HBM, or CMP during manufacturing?

Title: Re: Concern of connecting thin-oxide device to ground/power
Post by carlgrace on Jul 15^th, 2010, 3:33pm

They are worried about all three. Also, overvoltages due to current faults on the supply are possible. The tie cells are small, go ahead and use them!