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Design >> RF Design >> adding the pad to tsmc18rf
https://designers-guide.org/forum/YaBB.pl?num=1342604043

Message started by kamela on Jul 18^th, 2012, 2:34am

Title: adding the pad to tsmc18rf
Post by kamela on Jul 18^th, 2012, 2:34am

I want to add some pad to my tsmc18rf tech file. I have tried both methods : by copying the dvio library that contains the sig_pad library, into the tsmc18rf. and by adding those libraries from the tools\library path editor\... . but there was no changes in my lsw window. and there was no pad in it's list. I don't know how to do it. and i have an other question. how to use these pads in layout? and how to connect them to the circuit? my circuit is a front-end and i'm working by assura.
thanks before.

Title: Re: adding the pad to tsmc18rf
Post by vivarf on Aug 2^nd, 2012, 3:33am

Hi
Normally the pad is made of the top metal, and together with the pad you have a logic layer (called pad in tsmc18rf) to let fabricator know that you want that part of your chip open to the air. For the wirebond pad the size is can be small as 50x50 um.

Cheer

Title: Re: adding the pad to tsmc18rf
Post by kamela on Aug 2^nd, 2012, 8:26am

Hi
thank you for your reply .but before i read that the pad is made up all of metals and not only the top one. my pad is sig_pad and i want to connect it to the input of my lna and i don't know how to do it. please clarify it more. i'm sorry. i am doing it for the first time and i have no experience in rf layout. i explored the internet and the books . but i couldn't find any thing about what i want to know. and please introduce me an useful book about the rf layout if you know one.