The Designer's Guide Community Forum https://designers-guide.org/forum/YaBB.pl Design >> RF Design >> inductive degenration in cmos RF PA https://designers-guide.org/forum/YaBB.pl?num=1371810918 Message started by purplewolf on Jun 21st, 2013, 3:35am

Title: inductive degenration in cmos RF PA Post by purplewolf on Jun 21st, 2013, 3:35am Hello,  I am designing a single ended linear RF PA whose ground will be thorugh bondwires. Due to bond wire inductance, i experience lots of degration in gain. One way is to use differential which have virtual ground but i am using single ended design. Is there any way to fix it? I am thinking of proving 'clean' ground by using wafer probe. But i am unable to find any number for ground inductance i will experience with probe needles. Any idea?

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