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Design >> Analog Design >> Nulling the parasitic inductance of package
https://designers-guide.org/forum/YaBB.pl?num=1462415676

Message started by Shanw on May 4^th, 2016, 7:34pm

Title: Nulling the parasitic inductance of package
Post by Shanw on May 4^th, 2016, 7:34pm

My driver is short to the package, and I found that the parasitic inductance of the package can cause bad signal.

Besides making parallel package to reduce the inductance method, is there any other method I can do? Thanks.

Title: Re: Nulling the parasitic inductance of package
Post by raja.cedt on May 6^th, 2016, 8:34am

Not relay. But be careful on parallel package, that wont make your Inductance half of the original value due to mutual coupling. You can prove on paper that under perfect coupling (K=1) there is no change in the resultant Inductance. Few people try to reduce the loop area by keeping bond very close to the package plane, but this has reliability issues.

I would go with less slew rate, if circuit allows or consider Flip-chip if there are no thermal issues.

Best regards,
Raj.

Title: Re: Nulling the parasitic inductance of package
Post by RobG on May 16^th, 2016, 10:12am

I agree with Raja on two bond wires not make that big of a difference, but it does help. I'm not sure what you mean by "bad signal." If it is ringing then you can add some series R to dampen LC circuit.