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Measurements >> RF Measurements >> Proper gounding for wafer probing.
https://designers-guide.org/forum/YaBB.pl?num=1195772147

Message started by HFG on Nov 22^nd, 2007, 2:55pm

Title: Proper gounding for wafer probing.
Post by HFG on Nov 22^nd, 2007, 2:55pm

I have access to a GGB wafer wedge that holds 2 GSG probes and 4 DC probes. Iam trying to maximize the number of connections i can use and was wondering if i can use the grounds from the RF probes for my circuit ground or if i have to use one of the 4 DC probes.

Title: Re: Proper gounding for wafer probing.
Post by Stefan on Nov 23^rd, 2007, 1:07am

You can use the G from GSG for ground -
IF
- you don't care about ESD structures (remember that normally you should contact ground & VDD for ESD first, before connecting signals ...)
- your probe is able to carry enough dc current that might be used by the chip.

Title: Re: Proper gounding for wafer probing.
Post by HFG on Nov 23^rd, 2007, 1:08pm

Thanks for the reply, thats pretty much what i figured. I can't seem to find one source that contains all the information about probing. I can't find little bit of information here and there.