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https://designers-guide.org/forum/YaBB.pl Modeling >> Passive Devices >> Chip on board parasitical model https://designers-guide.org/forum/YaBB.pl?num=1206929207 Message started by email_gz on Mar 30th, 2008, 7:06pm |
Title: Chip on board parasitical model Post by email_gz on Mar 30th, 2008, 7:06pm Does any one know the COB parasitical model? How about the normal value per mm of Rp, Cp ,Lp, Mp/Kp? Thank you very much:) |
Title: Re: Chip on board parasitical model Post by pancho_hideboo on Mar 31st, 2008, 8:31am email_gz wrote on Mar 30th, 2008, 7:06pm:
What do you mean by COB ? Is it discreate chip components ? |
Title: Re: Chip on board parasitical model Post by email_gz on Apr 2nd, 2008, 1:07am pancho_hideboo wrote on Mar 31st, 2008, 8:31am:
Hello: COB means Chip on board, just bonding the die to PCB . |
Title: Re: Chip on board parasitical model Post by pancho_hideboo on Apr 6th, 2008, 11:05pm In ADS, there are bondwire models. These are available also in RFDE. See Chapter 4: Passive RF Circuit Components of the followings. http://eesof.tm.agilent.com/docs/adsdoc2005A/pdf/ccdist.pdf BONDW_Shape (Philips/TU Delft Bondwire Parameterized Shape) BONDW_Usershape (Philips/TU Delft Bondwire Model with User-DefinedShape) BONDW1 to BONDW50 (Philips/TU Delft Bondwires Model) |
Title: Re: Chip on board parasitical model Post by email_gz on Apr 14th, 2008, 8:47pm Thank you pancho_hideboo,it should be helpful to me! |
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