Michele,

  You might want to try this paper, it has a little different focus
but does provide some equations,

"Advances in RF Packaging Technologies for Next-GenerationWireless
Communications Applications (Invited Paper)", Larry Larsen and
Darryl Jessie, CICC, 2003

It give the formula for bond wire inductance and comments on the
effect of multiple bond wires.

                                                            Best Regards,

                                                               Sheldon