sheldon
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Kamesh,
You are not very clear about what you would like to do so it is difficult to make detailed recommendations.
First, Verilog-A includes a thermal discipline with two expressions: potential, Temperature, and flow, Power. To model system's thermal characteristics use the calculated power and thermal impedance of the chip, package, board, ... to calculate the Temperature for the component. Since you are building a system model, I would just create a black box model: Temperature input, transfer function from thermal to electrical, and then the desired electrical output interface. In this case, modeling the detailed operation of the temperature probably does not add any value to the simulation.
Again since you are building a system model, it might be better to abstract the functionality at the high level. I think that the complex part of the model will be developing the thermal model for the system: chip, package, board, [fan(?)], ...
Good Luck,
Sheldon
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