Hi,

I would like to know if there are any good references on choosing IC packages for use in high-performance designs? I have some appnoteson PCB design which discuss the matter very briefly but no reference which offers a good comparison between the various leadless packages available these days.

My interest is primarily in choosing a package for lab evaluations, and so ceramic packages are ok. The other point concerns IC sockets. Ideally, one would directly mount a very good package on the PCB. However, this makes life hard if one is trying to do lab evaluations and needs to do tests on various parts. Most of the IC sockets that I have come across are bad enough that the benefits of using the best of packages are lost.

How should one approach these two issues in order to get the best performance out of a chip?

Thanks
Vivek