SRF Tech
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Posts: 59
Arizona
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Jerry, The large common ground point has worked very well for me on many different products and technologies, but as ACW pointed out, layout and placement of the diodes and power bussing become critical with this approach. In all honesty, to do it right, you should also address noise and power distribution at the same time.
With regard to your point about raw die, that is an excellent reminder. I have seen more and more issues lately with problems related to this, and to a greater degree, in multi-chip packages where the ESD becomes dependent on the relationship between multiple die and their related interconnect in the same package.
regards, SRF
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