ACWWong
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Hi cedar, my 1p's worth would be: 1) The compromise between of maximum power with S22 shouldn't be such an issue, as the max power will generally coincident with good S22. 2) Bias control/design is often used to compensate temeprature gain variation. Either open loop (just give the bias an appropriate temp coeffiecent) or closed loop (sniff power, compare in control loop to control bias). 3) The more exact the modelling of the pads, bondwire, package, PCB the better!! Just using L and R without appropriate C will be problematic for the accuraccy of your simulation. 4) Potential oscillation may occur if you have not modelled all the coupling mechanisms which are not present in a simple schematic simulation. Layout coupling (capacitive and also inductive) both on the die, via bondwires, package and PCB can often cause unexpected oscillation. Careful attention to these points should allow you to predict/address potential oscillation problems. cheers aw
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