ACWWong
|
I guess the moral of the story is that when designing external world interfaced circuits, especially at high frequency (like LNA or PA), one must include all parasitic effects (pads, ESD, Layout, bondwire, packaging even pcb effects/components), so not to get a nasty shock when the chip comes back. Anyway, the bondwire inductor is acting as degeneration in your circuit, so it reduces gain and so increases noise, but makes it more linear/higher P1dB, higher IIP3). Knowing that the bondwire will be present should now allow you go round the design loop again to re optimise the gain/noise and linearity trade-off to meet your specification targets. cheers aw
|