smarty
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Dear Peter, Thanks for providing me an insight as to tackle this problem.
One more query to get myself clear. Since we need to do a noise and that to Switching noise, are we worried about the Ldi/dt noise (kindly correct me if I sound wrongly). We are targetting flip-chip package and from my understanding the overall inductance of the supply line should be low (since this is a flip-chip packaging).
I have thinking of 2 methods. I would be happy, if you can put your thoughts.
Method one: -------------- Can we do a small signal model and estimate the impedance of the supply and do an thevinins/norton, modelling the the Tx/Rx as a current source along with the supply resistance and capacitance. Then replicate this current source for 36 ports and do switching in the currnet source to estimate the noise generated at the supply.
Method two: --------------
As you have mentioned, do a switching of the TxRx for single and then extrapolate that for 36 ports.
For both the case, we need to model the supply and package parasitics to have the noise level.
Kindly let me know, if I have not sounded clear in my explaination.
Best Regards, SBR
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