sheldon
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Michele,
You might want to try this paper, it has a little different focus but does provide some equations,
"Advances in RF Packaging Technologies for Next-GenerationWireless Communications Applications (Invited Paper)", Larry Larsen and Darryl Jessie, CICC, 2003
It give the formula for bond wire inductance and comments on the effect of multiple bond wires.
Best Regards,
Sheldon
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