loose-electron
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Best Design Tool = Capable Designers
Posts: 1638
San Diego California
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Agreed with above on this being a useful strategy. A couple of ideas here:
1. Figure out the minimal pole placement needed for the roll off point. Frequency of interest in a mixed signal system is generally the system clock and all of its harmonics.
2. Bias distribution over long distances, should NOT be done as a gate voltage. Convert the bias control to a current, pass the current across the chip, and then recreate the gate voltage locally in a diode connected transistor. This avoids ground noise modulation issues, and also avoid matching problems with widely seperated MOS devices.
3. When the bias current arrives at the local location, pass it thru an RC filter as it goes into the MOS diode. The LPF that you get there is working against a high impedance source (the remote current source) to get lower frequency pole (for the same C in the LPF) and the series resistance helps push the LPF pole lower in frequency for noise capacitively coupled into the wire in the long transit path across the chip.
4. That local filter capacitnace has a constraint of a minimum pole placement and size, but as you get into layout of the chip, if some spare space becomes avaialble, fill the available space with a bigger C. Can not hurt and might help.
5. As a general rule, I ***never*** send a chip out with white space in the layout. If its not filled with spare parts for metal mask fixes after the first tapeout, its filled with power supply decoupling or bias decoupling.
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:)
Jerry
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