Hi all,

I have a receiver design with a RX and a PLL. I'm worried that if the RF section shares the same ground as the digital dividers of the PLL, then a lot of noise will couple to the RF section due to the substrate resistance. So I have the option of down-bonding either the digital divider's ground, or the RF section's ground, and using a separate pin for the other ground. Just curious, which one is better? Should I down-bond the digital divider ground, or the RF section, or should I just connect them both to the down-bond?

thanks,
Aaron