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The Designer's Guide Community Forum › Design › Analog Design › Concern of connecting thin-oxide device to ground/power
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Concern of connecting thin-oxide device to ground/power (Read 1508 times)
neoflash
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Concern of connecting thin-oxide device to ground/power
Jul 15th, 2010, 9:51am  
In sub-130nm process, tsmc requested to use tie-high tie-low for soft connection to power/gnd bus.

Not sure what kind of issue is getting worried? CDM, HBM, or CMP during manufacturing?
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carlgrace
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Re: Concern of connecting thin-oxide device to ground/power
Reply #1 - Jul 15th, 2010, 3:33pm  
They are worried about all three.  Also, overvoltages due to current faults on the supply are possible.  The tie cells are small, go ahead and use them!
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