Hello,
 I am designing a single ended linear RF PA whose ground will be thorugh bondwires. Due to bond wire inductance, i experience lots of degration in gain. One way is to use differential which have virtual ground but i am using single ended design. Is there any way to fix it?
I am thinking of proving 'clean' ground by using wafer probe. But i am unable to find any number for ground inductance i will experience with probe needles. Any idea?