petitivoire
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They were actually talking about substrate noise isolation. From what they're talking about, the back to back serves two purposes. It allows an ESD network to be designed for chips that have multiple power/gnd domains and at the same time provides substrate noise isolation. So I just stuck a back to back diode in my design and it's fine except at a semiconductor physics level, I'd like to visualize or understand how we achieve the noise isolation.
Thanks for your response.
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