michael_li
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Posts: 4
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The 2000M PA-Drvier is a common-emitter SiGe BJT amplifier with on-chip about 7nH RFC inductor, gnd pad bonding to exposed pad, and the output power is 8dBm while meeting the ACLP requriments , so dose the PA-Driver need on-chip supply bypass caps to minimize the supply bondwire effect, or for other reasons, in your experence ?
Please give me some suggestions!!
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