bonder repeatability is excellent, landing points are typically +/-10um, and looping is very well controlled.

matching other than this will depend on your bonding diagram and pin-out/leadframe. For well matched bondwires of course you must pay attention to these (critical high frequency differential pads on the middle of the die/package sides are best because they are short and less exposed to ESD events).

Modelling can be complicated by adjacent (adjacent +1, +2 etc. as well depending on land pitch), so a good em simulation of bondwires and package is needed.