Lex wrote on Apr 2nd, 2014, 1:46am:I share skepticism with Jerry..
I have heard many designers excuse themselves with "thermal response, package stress, substrate noise" and other things that are difficult to check, while for most times the problem turned out to be obvious things like low PSRR, poor settling speed or capacitive coupling.
I'll add models to that list of things that get blamed when it is really a something in layout, or a heat gradient
. Whatever you think it is, definitely be skeptical of your hypothesis and verify it thoroughly.
rg