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The Designer's Guide Community Forum › Design › Analog Design › Bandgap Temperature Coefficient susceptibility to packaging stress
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Bandgap Temperature Coefficient susceptibility to packaging stress (Read 10716 times)
Lex
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Eindhoven, Holland
Re: Bandgap Temperature Coefficient susceptibility to packaging stress
Reply #15 - May 14th, 2014, 1:44am  
Anything you can spot in the layout that can cause extra differential stress? E.g. STI, metal. (or such as Rob mentioned lack of dummies etc).

Did you double check with the foundry for feedback on the processing conditions. Even the big ones make mistakes: I had once a large offset on poly, with a different tempco than provided in the corner models.
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boe
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Re: Bandgap Temperature Coefficient susceptibility to packaging stress
Reply #16 - May 16th, 2014, 2:37pm  
Ic_engr,
stress-related effects can even depend on position on the die, orientation on die, etc...
- B O E
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