Not relay. But be careful on parallel package, that wont make your Inductance half of the original value due to mutual coupling. You can prove on paper that under perfect coupling (K=1) there is no change in the resultant Inductance. Few people try to reduce the loop area by keeping bond very close to the package plane, but this has reliability issues.

I would go with less slew rate, if circuit allows or consider Flip-chip if there are no thermal issues.

Best regards,
Raj.