Hello I am not an EE nor a RF expert by any means. But I do have the following questions to ask all of you experts in the field or RF Design. Our company is investigating the possibility of a hidden backdoor (wireless remote access) device embedded in the latest PC computer CPU's.

1. Is it possible and how to distinguish unintentional RF emissions (by way of a RF emissions testing) which is radiated by the CPU (computer motherboard) itself vs the unintentional RF emissions radiated by a hidden RF embedded device such as a transceiver or transmitter on the CPU die ?

2. Is it essential that the baseband IC (transceiver) and front end be located near the edges of the die and possibly on the top most base layer of one of the stacked die for a PC CPU example given above ?

Comments would be appreciated and thank you for taking the time to read this topic.