aaron_do
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Hi all,
i did a little reading on this, and my understanding is that if i add all this coupling caps from VDD to ground, it will lower the resonant frequency with the bondwire. As a result, high frequency signals will not be able to "escape" the chip. Therefore they will go back through the circuits and be seen as noise. So i should make sure the cap from vdd to ground is not too big...
Is this right?
thanks, Aaron
Sorry let me correct that...the part about the high frequency signals not being able to "escape" is wrong... so the only problem is that there may be resonance with the bondwire and the coupling cap...
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