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 Die per Wafer ! (Read 810 times)
 modu New Member Offline Posts: 2 Die per Wafer ! Feb 24th, 2012, 3:29am   Hello Everyone ! I'm currently reading a book about computer Architecture and i know that the number of die per wafer can be calculated as : dies per wafer = [PI*(waferdiameter/2)^2]/die area – (PI*waferdiameter)/sqrt(2*die area) . I was reading this example : Find the number of dies per 300mm (30 cm) wafer for a die that is 1.5 cm on a side . The answer say : The die is 2.25 cm^2 .ThusDie per wafer = PI * (30/2)2 / 2.25   - (PI * 30) / Sqrt( 2* 2.25) = 270.my problem is where did the 2.25 come from ? Please help ? Back to top IP Logged
 boe Community Fellow Offline Posts: 615 Re: Die per Wafer ! Reply #1 - Feb 24th, 2012, 5:46am   Modu,A hint: How do you calculate the area of a rectangle?- B O E Back to top IP Logged
 modu New Member Offline Posts: 2 Re: Die per Wafer ! Reply #2 - Feb 24th, 2012, 9:11am   Area of rectangle is : Width x Height .so, which means the 1.5 cm is only one side/ half  of the area ? Back to top IP Logged
 loose-electron Senior Fellow Offline Best Design Tool = Capable Designers Posts: 1638 San Diego California Re: Die per Wafer ! Reply #3 - Feb 24th, 2012, 2:17pm   please, is this a joke?1.5cm is the length of one sidethe die is square1.5 X 1.5 = 2.25cm^2 which is the area. Back to top Jerry Twomeywww.effectiveelectrons.comRead My Electronic Design Column Here Contract IC-PCB-System Design - Analog, Mixed Signal, RF & Medical   IP Logged
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