modu
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Hello Everyone ! I'm currently reading a book about computer Architecture and i know that the number of die per wafer can be calculated as : dies per wafer = [PI*(waferdiameter/2)^2]/die area – (PI*waferdiameter)/sqrt(2*die area) .
I was reading this example : Find the number of dies per 300mm (30 cm) wafer for a die that is 1.5 cm on a side .
The answer say : The die is 2.25 cm^2 .Thus Die per wafer = PI * (30/2)2 / 2.25  (PI * 30) / Sqrt( 2* 2.25) = 270.
my problem is where did the 2.25 come from ? Please help ?
