If you use an actual SoC such as the Qualcomm Snapdragon Processor for mobile communications would it be possible to have two cores both sharing a common IO (Cellular/WiFi/GPS/Bluetooth) integrated circuits but its own separate antenna ? Would the baseband processor and lna amplifier modulator oscillator be required to be located only at the top most layer (where inductors are found) of the die ? So would this mean it is not possible to have two cores with its own separate antenna if the one of the cores is located somewhere other then on the top most layer since the lna amplifiers oscillators baseband processor are located on the top layer ?

loose-electron wrote on Dec 14^th, 2015, 10:05pm:


Hello loose-electon. Thank you for the response. I did take a look at the SDR resources online. However I thought I should explain the rational behind the question asked on this forum. What I would like to learn is not how to go about designing and implementing such a technology (using two antennas) but whether it could be done.

So having said the above would you help in understanding whether two separate antennas operating with different frequency ranges could work effectively ? Also if the technologies to support two antennas could exist would it be possible to implement two different baseband IC's for two separate transceivers located on different layers of the SoC die ? Or having two antennas using different frequency range could and be implemented by one common transceiver and baseband IC's ?

I hope that my understanding of the above RF technologies are not misunderstood.

Thank you for the comments

loose-electron wrote on Dec 20^th, 2015, 10:31pm:


Thank you again loose-electron. Could you answer one more question ? If it is possible without the potential for noise coupling could the two transceivers exist on the same layer and if only one transceiver is deployed could this single transceiver IC be located anywhere on the die or would it have to be located right on the top most layer of the die ?

Thanks

loose-electron wrote on Dec 28^th, 2015, 4:03pm:


Thank you again loose-electron.

My understanding of how a die of an IC is implemented is with multiple layers with each layer stacked over the next. So using an example of the Qualcomm Snapdragon SoC 810/820 IC I assumed this 3D IC would have multiple active layers (with silicon gate transistors integrated circuits) all interconnected vertically to the layer above and below ?

Then would you be saying that that most IC's (such as the Snapdragon 810/820) have only a few main (base) active layers and the rest (upper and or lower) are for metal interconnections ? So the base layers are at the bottom of the die and the upper layers are for the metal interconnections ?

Assuming that I have understood your response properly then could it possible in practice to have two transceivers (baseband IC and front ends) located either on the same base layer or on two different base layers ?

Many thanks for the responses.

loose-electron wrote on Dec 30^th, 2015, 7:05pm:


Thank you again loose-electron. Thanks for the answer to the multi transceiver on die. As for stacked die do you mean that an IC such as the Qualcomm SoC 810/820 may have multi dies all in the same package ? So each die has 1-2 base layers and the rest are for like you said metal interconnections ? If this is true then having two transceivers (two front ends two separate antennas) not work on a separate dies but all enclosed in the same package ?

Thank you (Happy New Year)