loose-electron wrote on Dec 28th, 2015, 4:03pm:You talk about layers in the IC as if they are a multi floor building.
Generally the base layers of an IC are where the transistors are defined and created.
Upper layers of the chip are used for metal interconnection.
Consequently any device will reside on all layers of the semiconductor.
Thank you again loose-electron.
My understanding of how a die of an IC is implemented is with multiple layers with each layer stacked over the next. So using an example of the Qualcomm Snapdragon SoC 810/820 IC I assumed this 3D IC would have multiple active layers (with silicon gate transistors integrated circuits) all interconnected vertically to the layer above and below ?
Then would you be saying that that most IC's (such as the Snapdragon 810/820) have only a few main (
base) active layers and the rest (upper and or lower) are for metal interconnections ? So the base layers are at the bottom of the die and the upper layers are for the metal interconnections ?
Assuming that I have understood your response properly then could it possible in
practice to have two transceivers (baseband IC and front ends) located either on the same base layer or on two different base layers ?
Many thanks for the responses.